ADAU1860BCBZRL
56-BUMP WAFER LEVEL CHIP SCALE P
part Number:
ADAU1860BCBZRL
Alternative models:
ADAU1788BCBZRL,MAX77654MENV+T,ADAU1861BCSZ-RL,MX25U3232FBHI02,AD74115BCPZ-RL7,ADAU1787BCBZRL,MAX17303X+T,AD74115HBCPZ-RL7,W25Q128JWPIQ,TZ3525AOAR83,NAU88C10YG,ADAU1787BCBZRL7,SM02B-GHS-TB,PI4IOE5V6408ZTAEX,MSPM0L1105TRHBR
manufacturer:
AD
category:
Integrated Circuits (ICs) > Interface > CODECS >
describe:
56-BUMP WAFER LEVEL CHIP SCALE P
RoHS:
YES
ADAU1860BCBZRL specifications
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Resolution (Bits):
24 b
Type:
Audio
Package / Case:
56-UFBGA, WLCSP
Data Interface:
I2C, I2S, SPI
Voltage - Supply, Analog:
1.7V ~ 1.98V
Sigma Delta:
No
Number of ADCs / DACs:
3 / 1
Dynamic Range, ADCs / DACs (db) Typ:
110 / 130
Voltage - Supply, Digital:
0.85V ~ 1.21V
Supplier Device Package:
56-WLCSP (2.98x2.68)
Quick inquiry
Manufacturer's standard delivery time:be pending
Standard Pack Quantity:6352
quantity
unit price
International prices
5000
8.77
43850
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